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Emerson Awards Helix Innovation Scholarships

Nov. 4, 2019
Students awarded $50,000 in scholarships towards their work at The Helix Innovation Center.

Dayton, Ohio, November 4, 2019 – Emerson today announced the five recipients of The Helix Innovation Scholarships at the University of Dayton. Awards were presented to students in engineering, business and the arts with demonstrated skills and enthusiasm in creative thinking, innovation and problem-solving.

Each student was presented a $10,000 scholarship from Emerson. Emerson will also assign each student a mentor to help guide their interest in innovation and support their education and growth.

The five scholarship recipients were recognized at The Helix Innovation Center on the University of Dayton campus earlier this month.

“Through the mentor relationships, our staff can stay engaged with young, creative minds,” said Rajan Rajendran, vice president of system innovation and sustainability for Emerson’s Commercial & Residential Solutions platform. “We’re excited to partner with the University of Dayton to collaborate, inspire and help grow the future workforce.”

The Helix Innovation 2019 Scholarships were awarded to the following University of Dayton students:

Dejuan A. Marion          Computer Engineering                 3rd year                 Bedford, OH

Vivian M. Mota              Mechanical Engineering              2nd  year                 Melrose Park, IL

Adriana Paonessa         Industrial Engineering                 2nd year                 Coto Laurel, Puerto Rico

Leigh Roberts                 Pre-Med                                       4th year                  Noblesville, IN

Mike Sundermeier          Marketing                                   4th year                 Palos Park, IL